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D. Chaudhuri, H. Rahaman and T. Ghosh, A Novel Approach for Performance Improvements of TSV and TTSV of 3D IC through Thermo electric effect and Mechanical reliability Analysis, Sadhana, Springer Nature Link, (under review), 2025
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A. K. Panigrahy, T. Ghosh, S. R. K. Vanjari, S. G. Singh, Surface density gradient engineering precedes enhanced diffusion; drives CMOS in-line process flow compatible Cu–Cu thermocompression bonding at 75° C, 19, pp. 791-795, IEEE Transactions on Device and Materials Reliability, 2019
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Asisa Kumar Panigrahi ,Tamal Ghosh ,C. Hemanth Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari, Direct, CMOS In?Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering, 14, 328-335, Electronic Materials Letters, 2019
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Panigrahi, Asisa Kumar & Cheemalamarri, Hemanth Kumar, Sathish, Bonam & Ghosh, Tamal & Vanjari, Siva & Singh, Shiv., Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications February 2017 : Japanese Journal of Applied Physics 57(2S1):02BC04 DOI:10.7567/JJAP.57.02BC04, 57, 02BC04. 10.7567/JJAP.57.02BC04., Japanese Journal of Applied Physics, 2017
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A. K. Panigrahi, T. Ghosh, S. R. K. Vanjari ,S. G. Singh, Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding,, 64, 1239-1245, IEEE Transactions on Electron Devices, 2017
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Panigrahi, A. K., Ghosh, T., Vanjari, S. R. K., & Singh, S. G., Demonstration of Sub 150° C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer, 194, 86-89, Materials Letters, 2017
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Panigrahi, Asisa Kumar, Satish Bonam, Tamal Ghosh, Shiv Govind Singh, and Siva Rama Krishna Vanjari, Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure, Materials Letters, 2016
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Ghosh, Tamal, K. Krushnamurthy, Asisa Kumar Panigrahi, Asudeb Dutta, Ch Subrahmanyam, Siva Rama Krishna Vanjari, and Shiv Govind Singh, Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding, RSC Advances, 2015
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U. Chatterjeea, , , A. Dasa, T. Ghoshc, S.P. Duttaguptaa, M.N. Gandhib, S.G. Singh, Effect of post deposition annealing on thermal evaporated ZnSe:Te towards a scintillator application, Microelectronic Engineering, 2014
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Ghosh, Tamal, Ashudeb Dutta, Shivgovind Singh, Copper Protection by SAM and Low Temperature Bonding for 3Dimentional Integration, Advanced Materials Research, 2013
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D. Chaudhuri, H. Rahaman and T. Ghosh, Exploring the Characterisation of a Si-Ge MOSFET-based 3D IC for Enhanced Integrated Circuit Performance, 7th International Symposium on Devices, Circuits & Systems, May 27-30, 2025, 2025
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Chaudhuri, D., Jamal, R., Rahaman, H., Ghosh, T., Thermo-electro-mechanical Effects of Copper TSV Interconnects on the MOS Characteristics in Stacked 3D Integration., vol 974, 627--636, COMSYS 2023, 2024
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Chaudhuri, D., Rahaman, H., Ghosh, T., A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding, Emerging Electronic Devices, Circuits and Systems. Lecture Notes in Electrical Engineering, vol 1004. Springer, 2023
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D. Chaudhuri, D. N. Das, H. Rahaman and T. Ghosh, Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias, IEEE 15th International Conference on Industrial and Information Systems (ICIIS), 2020
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D. Chaudhuri, D. Nandi Das, H. Rahaman and T. Ghosh, Heat Mitigation in 3D ICs by Improvised TTSV Structure, International Symposium on Devices, Circuits and Systems (ISDCS), 2020
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A. K. Panigrahy, S. Bonam, T. Ghosh, S. R. K. Vanjari and S. G. Singh, Diffusion Enhanced Drive Sub 100 °C Wafer Level Fine-Pitch Cu-Cu Thermocompression Bonding for 3D IC Integration, IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019
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Asisa Kumar Panigrahi, C Hemanth Kumar, Satish Bonam, Paul K Brince, Tamal Ghosh, Nirupam Paul, Siva Rama Krishna Vanjari, Shiv Govind Singh, Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applications, IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
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A. K. Panigrahi, T. Ghosh, S. R. K. Vanjari and S. G. Singh, Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration, IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, 2017
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A. K. Panigrahi, C. H. Kumar, T. Ghosh, S. R. K. Vanjari, S. G. Singh, Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration, 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, 2017
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A. Kumar Panigrahi, S. Bonam, T. Ghosh, S. R. Krishna Vanjari and S. Govind Singh, Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration, 2016 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, 2016
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A. K. Panigrahi, S. Bonam, T. Ghosh, S. R. K. Vanjari and S. G. Singh, High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 1600C,, IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2016
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Panigrahi, Asisa Kumar; Bonam, Satish; Ghosh, Tamal; Vanjari, Siva Rama Krishna; Singh, Shiv Govind,, Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2016
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Panigrahi, Asisa Kumar, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, and Shiv Govind Singh, Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding, 3D Systems Integration Conference (3DIC), 2015 International, 2015
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Ghosh, Tamal; Gagan, G C; Dutta, Ashudeb; SivaRamaKrishna, Vanjari; Singh, Shiv Govind, Hybrid TTSV structure for heat mitigation and energy harvesting in 3D IC,, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2015
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Ghosh, Tamal; Krushnamurthy, E.; Subrahmanyam, Ch.; SivaRamaKrishna, V.; Dutta, A.; Singh, S G, Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2015
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Ghosh, T.; Krishna, V.S.R.; Singh, S.G, Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer, 2014 IEEE 2nd International Conference onEmerging Electronics (ICEE), 2014
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Patel, S.B.; Ghosh, T.; Dutta, A.; Singh, S, Stress analysis in 3D IC having Thermal Throug Silicon Vias (TTSV), Electronic Components and Technology Conference (ECTC), 2013
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1. Ghosh, T.; Dutta, A.; Lingareddy, E.; Subrahmanyam, C.; Singh, S.G, Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs, 2012 International Conference on Emerging Electronics (ICEE), 2012
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