Ph.D (VLSI & Microelectronics)
M-Tech- Radio physics & Electronics
B.E (E.C.E.)
Area of work: Three Dimensional Integration Circuits
Semiconductor devices
1
Asisa Kumar Panigrahi ,Tamal Ghosh ,C. Hemanth Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari, Direct, CMOS In?Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering, 14, 328-335, Electronic Materials Letters, 2019
2
A. K. Panigrahi, T. Ghosh, S. R. K. Vanjari ,S. G. Singh, Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding,, 64, 1239-1245, IEEE Transactions on Electron Devices, 2017
3
Panigrahi, A. K., Ghosh, T., Vanjari, S. R. K., & Singh, S. G., Demonstration of Sub 150° C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer, 194, 86-89, Materials Letters, 2017
4
Panigrahi, Asisa Kumar, Satish Bonam, Tamal Ghosh, Shiv Govind Singh, and Siva Rama Krishna Vanjari, Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure, Materials Letters, 2016
5
Ghosh, Tamal, K. Krushnamurthy, Asisa Kumar Panigrahi, Asudeb Dutta, Ch Subrahmanyam, Siva Rama Krishna Vanjari, and Shiv Govind Singh, Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding, RSC Advances, 2015
6
U. Chatterjeea, , , A. Dasa, T. Ghoshc, S.P. Duttaguptaa, M.N. Gandhib, S.G. Singh, Effect of post deposition annealing on thermal evaporated ZnSe:Te towards a scintillator application, Microelectronic Engineering, 2014
7
Ghosh, Tamal, Ashudeb Dutta, Shivgovind Singh, Copper Protection by SAM and Low Temperature Bonding for 3Dimentional Integration, Advanced Materials Research, 2013
8
Ghosh, T.; Dutta, A.; Lingareddy, E.; Subrahmanyam, C.; Singh, S.G, Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs, Emerging Electronics (ICEE), 2012 International Conference on, 2012
