| # | List of Publication by Dr. Tamal Ghosh |
|---|---|
| 1 | D. Chaudhuri, H. Rahaman and T. Ghosh, A Novel Approach for Performance Improvements of TSV and TTSV of 3D IC through Thermo electric effect and Mechanical reliability Analysis, Sadhana, Springer Nature Link, (under review), 2025 |
| 2 | A. K. Panigrahy, T. Ghosh, S. R. K. Vanjari, S. G. Singh, Surface density gradient engineering precedes enhanced diffusion; drives CMOS in-line process flow compatible Cu–Cu thermocompression bonding at 75° C, 19, pp. 791-795, IEEE Transactions on Device and Materials Reliability, 2019 |
| 3 | Asisa Kumar Panigrahi ,Tamal Ghosh ,C. Hemanth Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari, Direct, CMOS In?Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering, 14, 328-335, Electronic Materials Letters, 2019 |
| 4 | Panigrahi, Asisa Kumar & Cheemalamarri, Hemanth Kumar, Sathish, Bonam & Ghosh, Tamal & Vanjari, Siva & Singh, Shiv., Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications February 2017 : Japanese Journal of Applied Physics 57(2S1):02BC04 DOI:10.7567/JJAP.57.02BC04, 57, 02BC04. 10.7567/JJAP.57.02BC04., Japanese Journal of Applied Physics, 2017 |
| 5 | Panigrahi, A. K., Ghosh, T., Vanjari, S. R. K., & Singh, S. G., Demonstration of Sub 150° C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer, 194, 86-89, Materials Letters, 2017 |
| 6 | A. K. Panigrahi, T. Ghosh, S. R. K. Vanjari ,S. G. Singh, Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding,, 64, 1239-1245, IEEE Transactions on Electron Devices, 2017 |
| 7 | Panigrahi, Asisa Kumar, Satish Bonam, Tamal Ghosh, Shiv Govind Singh, and Siva Rama Krishna Vanjari, Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure, Materials Letters, 2016 |
| 8 | Ghosh, Tamal, K. Krushnamurthy, Asisa Kumar Panigrahi, Asudeb Dutta, Ch Subrahmanyam, Siva Rama Krishna Vanjari, and Shiv Govind Singh, Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding, RSC Advances, 2015 |
| 9 | U. Chatterjeea, , , A. Dasa, T. Ghoshc, S.P. Duttaguptaa, M.N. Gandhib, S.G. Singh, Effect of post deposition annealing on thermal evaporated ZnSe:Te towards a scintillator application, Microelectronic Engineering, 2014 |
| 10 | Ghosh, Tamal, Ashudeb Dutta, Shivgovind Singh, Copper Protection by SAM and Low Temperature Bonding for 3Dimentional Integration, Advanced Materials Research, 2013 |
Created: 23 November 2019