| # | List of Publication by Dr. Tamal Ghosh |
|---|---|
| 1 | D. Chaudhuri, H. Rahaman and T. Ghosh, Exploring the Characterisation of a Si-Ge MOSFET-based 3D IC for Enhanced Integrated Circuit Performance, 7th International Symposium on Devices, Circuits & Systems, May 27-30, 2025, 2025 |
| 2 | Chaudhuri, D., Jamal, R., Rahaman, H., Ghosh, T., Thermo-electro-mechanical Effects of Copper TSV Interconnects on the MOS Characteristics in Stacked 3D Integration., vol 974, 627--636, COMSYS 2023, 2024 |
| 3 | Chaudhuri, D., Rahaman, H., Ghosh, T., A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding, Emerging Electronic Devices, Circuits and Systems. Lecture Notes in Electrical Engineering, vol 1004. Springer, 2023 |
| 4 | D. Chaudhuri, D. Nandi Das, H. Rahaman and T. Ghosh, Heat Mitigation in 3D ICs by Improvised TTSV Structure, International Symposium on Devices, Circuits and Systems (ISDCS), 2020 |
| 5 | D. Chaudhuri, D. N. Das, H. Rahaman and T. Ghosh, Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias, IEEE 15th International Conference on Industrial and Information Systems (ICIIS), 2020 |
| 6 | A. K. Panigrahy, S. Bonam, T. Ghosh, S. R. K. Vanjari and S. G. Singh, Diffusion Enhanced Drive Sub 100 °C Wafer Level Fine-Pitch Cu-Cu Thermocompression Bonding for 3D IC Integration, IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019 |
| 7 | Asisa Kumar Panigrahi, C Hemanth Kumar, Satish Bonam, Paul K Brince, Tamal Ghosh, Nirupam Paul, Siva Rama Krishna Vanjari, Shiv Govind Singh, Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applications, IEEE 68th Electronic Components and Technology Conference (ECTC), 2018 |
| 8 | A. K. Panigrahi, C. H. Kumar, T. Ghosh, S. R. K. Vanjari, S. G. Singh, Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration, 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, 2017 |
| 9 | A. K. Panigrahi, T. Ghosh, S. R. K. Vanjari and S. G. Singh, Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration, IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, 2017 |
| 10 | Panigrahi, Asisa Kumar; Bonam, Satish; Ghosh, Tamal; Vanjari, Siva Rama Krishna; Singh, Shiv Govind,, Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2016 |
| 11 | A. K. Panigrahi, S. Bonam, T. Ghosh, S. R. K. Vanjari and S. G. Singh, High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 1600C,, IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2016 |
| 12 | A. Kumar Panigrahi, S. Bonam, T. Ghosh, S. R. Krishna Vanjari and S. Govind Singh, Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration, 2016 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, 2016 |
| 13 | Ghosh, Tamal; Krushnamurthy, E.; Subrahmanyam, Ch.; SivaRamaKrishna, V.; Dutta, A.; Singh, S G, Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2015 |
| 14 | Ghosh, Tamal; Gagan, G C; Dutta, Ashudeb; SivaRamaKrishna, Vanjari; Singh, Shiv Govind, Hybrid TTSV structure for heat mitigation and energy harvesting in 3D IC,, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2015 |
| 15 | Panigrahi, Asisa Kumar, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, and Shiv Govind Singh, Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding, 3D Systems Integration Conference (3DIC), 2015 International, 2015 |
| 16 | Ghosh, T.; Krishna, V.S.R.; Singh, S.G, Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer, 2014 IEEE 2nd International Conference onEmerging Electronics (ICEE), 2014 |
| 17 | Patel, S.B.; Ghosh, T.; Dutta, A.; Singh, S, Stress analysis in 3D IC having Thermal Throug Silicon Vias (TTSV), Electronic Components and Technology Conference (ECTC), 2013 |
| 18 | 1. Ghosh, T.; Dutta, A.; Lingareddy, E.; Subrahmanyam, C.; Singh, S.G, Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs, 2012 International Conference on Emerging Electronics (ICEE), 2012 |
Created: 23 November 2019