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    Conference

    # List of Publication by Dr. Tamal Ghosh
    1 Chaudhuri, D., Rahaman, H., Ghosh, T., A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding, Emerging Electronic Devices, Circuits and Systems. Lecture Notes in Electrical Engineering, vol 1004. Springer, 2023
    2 D. Chaudhuri, D. Nandi Das, H. Rahaman and T. Ghosh, Heat Mitigation in 3D ICs by Improvised TTSV Structure, International Symposium on Devices, Circuits and Systems (ISDCS), 2020
    3 D. Chaudhuri, D. N. Das, H. Rahaman and T. Ghosh, Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias, IEEE 15th International Conference on Industrial and Information Systems (ICIIS), 2020
    4 A. K. Panigrahy, S. Bonam, T. Ghosh, S. R. K. Vanjari and S. G. Singh, Diffusion Enhanced Drive Sub 100 °C Wafer Level Fine-Pitch Cu-Cu Thermocompression Bonding for 3D IC Integration, IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2019
    5 Asisa Kumar Panigrahi, C Hemanth Kumar, Satish Bonam, Paul K Brince, Tamal Ghosh, Nirupam Paul, Siva Rama Krishna Vanjari, Shiv Govind Singh, Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applications, IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
    6 A. K. Panigrahi, C. H. Kumar, T. Ghosh, S. R. K. Vanjari, S. G. Singh, Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration, 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, 2017
    7 A. K. Panigrahi, T. Ghosh, S. R. K. Vanjari and S. G. Singh, Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration, IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, 2017
    8 Panigrahi, Asisa Kumar; Bonam, Satish; Ghosh, Tamal; Vanjari, Siva Rama Krishna; Singh, Shiv Govind,, Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2016
    9 A. K. Panigrahi, S. Bonam, T. Ghosh, S. R. K. Vanjari and S. G. Singh, High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 1600C,, IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 2016
    10 A. Kumar Panigrahi, S. Bonam, T. Ghosh, S. R. Krishna Vanjari and S. Govind Singh, Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration, 2016 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, 2016
    11 Ghosh, Tamal; Krushnamurthy, E.; Subrahmanyam, Ch.; SivaRamaKrishna, V.; Dutta, A.; Singh, S G, Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2015
    12 Ghosh, Tamal; Gagan, G C; Dutta, Ashudeb; SivaRamaKrishna, Vanjari; Singh, Shiv Govind, Hybrid TTSV structure for heat mitigation and energy harvesting in 3D IC,, Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, 2015
    13 Panigrahi, Asisa Kumar, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, and Shiv Govind Singh, Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding, 3D Systems Integration Conference (3DIC), 2015 International, 2015
    14 Ghosh, T.; Krishna, V.S.R.; Singh, S.G, Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer, 2014 IEEE 2nd International Conference onEmerging Electronics (ICEE), 2014
    15 Patel, S.B.; Ghosh, T.; Dutta, A.; Singh, S, Stress analysis in 3D IC having Thermal Throug Silicon Vias (TTSV), Electronic Components and Technology Conference (ECTC), 2013
    16 1. Ghosh, T.; Dutta, A.; Lingareddy, E.; Subrahmanyam, C.; Singh, S.G, Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs, 2012 International Conference on Emerging Electronics (ICEE), 2012

    Created: 23 November 2019